SUBSTRATE TREATING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating device and a substrate treatment method capable of preventing a treatment liquid from being scattered to the periphery of a substrate and treating the substrate using the treatment liquid. SOLUTION: The treatment liquid held on the lower surface of a push-pull nozzle 15 is brought into contact with a wafer W being rotated. In this state, the push-pull nozzle 15 is allowed to reciprocate between a position including a rotation center C in the wafer W and the position of the peripheral section of the wafer W by the rocking of the rocking arm 14. The liquid-contacting position on the surface of the wafer W draws an arc trajectory and reciprocates, thus bringing the entire region on the surface of the wafer W into liquid-contact with a medicinal solution. COPYRIGHT: (C)2008,JPO&INPIT