| 摘要 |
PROBLEM TO BE SOLVED: To prevent nonuniformity in the temperature distribution of a substrate W to be treated by radiation from a side surface, concerning a substrate heating device for heating the substrate W to be treated by placement-supporting. SOLUTION: A first electrode 13A for heating is arranged along the surface of the substrate-heating device 10, so as to generate heat by a first voltage-applying means 15A, and also a second electrode 13B for heating is arranged along the side surface of the substrate-heating device, so as to generate heat by a second voltage-applying means 15B. Consequently, temperature reduction is prevented in the outer circumferential part by covering the discharge from the side surface, and heating is performed so as to obtain uniform temperature distribution in the substrate W to be treated. COPYRIGHT: (C)2008,JPO&INPIT
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