MICROCAPSULE TYPE CURING AGENT AND CURABLE RESIN COMPOSITION CONTAINING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition curable at low temperatures and excellent in storage stability. SOLUTION: This curable resin composition comprises a microcapsule type curing agent including a curing agent as a core component in a shell component which is an organic compound having a melting point of 50-130°C and a curable resin. COPYRIGHT: (C)2008,JPO&INPIT