| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting filmy adhesive composition which is excellent in adhesion and thermal resistance, can form a sealing composition capable of being packed into fine clearances and does not form a cured product running off the edges of resin films. SOLUTION: The thermosetting-type filmy adhesive composition used is the film which is formed by dissolving a resin composition comprising (A) a nitrile/butadiene rubber, (B) a phenol resin, (C) a polyamide resin and (D) a plasticizer in (E) an organic solvent, and thereafter, removing the organic solvent to a concentration of practically no remnant, to form a film having a thickness of 10-100μm. COPYRIGHT: (C)2008,JPO&INPIT
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