| 摘要 |
The present invention relates to an electronic circuit unit having at least one semiconductor ( 15 ), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections ( 20 ) each have a contact surface ( 17 ) situated on the substrate ( 12 ) which, when the substrate ( 12 ) and the housing ( 2 ) are joined together, comes to lie in an opposing position to the counter-contact surfaces ( 19 ) of the contact paths ( 21 ). The present invention also relates to a corresponding manufacturing method.
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