发明名称 CIRCUIT BOARD WITH A PERFORATED STRUCTURE FOR DISPOSING A HEAT PIPE
摘要 A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.
申请公布号 US2008062649(A1) 申请公布日期 2008.03.13
申请号 US20060566236 申请日期 2006.12.04
申请人 LENG YAO-SHIH;HUANG YAO-YI;YANG SHANG-CHIH 发明人 LENG YAO-SHIH;HUANG YAO-YI;YANG SHANG-CHIH
分类号 H05K7/20 主分类号 H05K7/20
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