| 摘要 |
The present invention provides an annealing apparatus including a heating unit, a storage unit, a calculating unit, and a control unit. The heating unit anneals a target wafer. The storage unit stores reference data which a shape parameter of a reference element, an annealing temperature, and an electrical characteristic of the reference element are associated with one another. The reference data is obtained by measuring a wafer previously manufactured. The calculating unit determines an actual annealing temperature based on the reference data and measurement data to attain target electrical characteristic. The measurement data include a shape parameter of an element formed in the target wafer. The control unit controls the heating unit to anneal the target wafer at the actual annealing temperature.
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