| 摘要 |
PROBLEM TO BE SOLVED: To form a uniform resist coat on a wafer surface in a coating treatment of coating liquids such as resist liquid. SOLUTION: At first a wafer is turned with a first rotational speed, and resist liquid is applied onto the turned wafer. Then, the wafer rotation is decelerated to a second rotational speed that is slower than the first rotational speed, thus turning the wafer at a slower speed to make uniform the resist liquid on the wafer. Next, the wafer's rotation is accelerated to a third rotational speed that is faster than the second rotational speed, and at least either a solvent gas or a dry gas is supplied to the resist liquid on the wafer. At this time, the solvent gas is supplied to a part thicker than a set thickness of the resist liquid on the wafer while on the other hand, the dry gas is supplied to a part thinner than a set thickness of the resist liquid on the wafer. By so doing, the part where the resist liquid is thick will become thin, and the thin part will become thick. After that, the wafer's rotation speed is accelerated to a fourth rotational speed faster than the third rotational speed to dry off the resist liquid on the wafer. COPYRIGHT: (C)2008,JPO&INPIT
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