发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To make improvement in photosensitivity compatible with improvement in optical characteristics by arranging an intralayer optical filter without expanding a distance between a light-receiving face of a photodiode (a photoelectric conversion part) and a microlens. SOLUTION: A rear-side irradiation structure and an intralayer optical filter structure are combined with each other, so that a laminated film including an IR cut filter 210 and an intralayer lens 211 is formed on the rear side of a silicon substrate 200 while the microlens 214 is arranged on the upper face of the laminated film via a color filter 213. The IR cut filter 210 is composed by alternately laminating a plurality of SiO films and SiN films or the like. By such a structure, there is no laminated film of a multilayer wiring structure between the photodiode 201 and the microlens 214. Therefore, it is possible to achieve the improvement in sensitivity while reducing the distance between the light-receiving face of the photodiode 201 and the microlens 214. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060320(A) 申请公布日期 2008.03.13
申请号 JP20060235471 申请日期 2006.08.31
申请人 SONY CORP 发明人 GODAIIN HIRONORI
分类号 H01L27/14;H04N5/335;H04N5/341;H04N5/357;H04N5/369 主分类号 H01L27/14
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