| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for supplying a refrigerant from the outside, to provide electronic equipment having high cooling performance utilizing evaporation latent heat, and to provide a cooling method of the electronic equipment. SOLUTION: In the cooling method, an electrical heating element, such as a semiconductor chip 1, and a water storage region 22 having a water absorption material or a hygroscopic material 23 are changed into vapor 27 by thermally connecting at least one portion of the water storage region to the electrical heating element and evaporating moisture, and the periphery is cooled by the latent heat. The electronic equipment has the electrical heating element in a casing, and the water storage region having a water absorption material or a hygroscopic material. A ventilation duct 25 for discharging vapor to the outside is provided in the casing. The upper and lower portions of the moisture absorption material or the hygroscopic material 23 are sandwiched by a moisture-permeable sheet 24 that permeates gas but does not liquid. The vapor that has absorbed heat with excessive evaporation latent heat can be discharged as it is, thus realizing the electronic equipment having high cooling performance. COPYRIGHT: (C)2008,JPO&INPIT
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