| 摘要 |
With a mounting structure for an IC tag where an IC chip for mounting ( 10 ) is mounted so as to be electrically connected to antenna patterns ( 44 a), ( 44 b), the assembly process that mounts the IC chip for mounting ( 10 ) on the antenna patterns ( 44 a), ( 44 b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires ( 12 a), ( 12 b) so as to encircle an outer surface of an IC chip ( 20 ) between two opposite edges of the IC chip ( 20 ) in a state where the conductive wires ( 12 a), ( 12 b) mechanically contact electrodes formed on the IC chip ( 20 ) and are electrically connected to the electrodes, so that the IC chip for mounting ( 10 ) is joined to the antenna patterns ( 44 a), ( 44 b) via the conductive wires ( 12 a), ( 12 b).
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