发明名称 |
VERBESSERTE STRUKTUR GESTAPELTER KONTAKTLÖCHER IN MEHRSCHICHTIGEN ELEKTRONISCHEN BAUELEMENTETRÄGERN |
摘要 |
A stacked via structure ( 200 ) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks ( 205 a, 205 b, 205 c) belonging to three adjacent conductive layers ( 110 a, 110 b, 110 c) separated by dielectric layers ( 120 ), aligned according to z axis. Connections between these conductive tracks are done with at least two vias ( 210, 215 ) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis. |
申请公布号 |
DE60314868(T2) |
申请公布日期 |
2008.03.13 |
申请号 |
DE2003614868T |
申请日期 |
2003.04.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
CASTRIOTTA, MICHELE;OGGIONI, STEFANO;ROGIANI, GIANLUCA;SPREAFICO, MAURO;VIERO, GIORGIO |
分类号 |
H05K1/11;H05K3/46;H01L23/498;H01L23/538;H01L23/66;H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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