| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting an electronic element such as a semiconductor photodetecting element, which has an electronic element mounting portion having a highly flat surface. <P>SOLUTION: In the wiring board having a plurality of wiring layers 5 formed on the surface of an insulating substrate 1, metal column terminals 2 are erected on the upper surface of each of the wiring layers 5, and an insulating coating 4 is formed on the side surface of each of the metal column terminals 2. Since the mounting surface can be polished centrally on the erected metal column terminals 2 without being influenced by the insulating substrate 1, the mounting surface of the electronic element 3 consisting of the metal column terminals 2 can be made to have very high planarity. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
