INSPECTION DEVICE AND INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method capable of detecting the state of a solder paste inside. SOLUTION: An illumination device 5 irradiates a substrate on which solder paste is applied with infrared light having a prescribed intensity. An imaging device 6 images the substrate irradiated with the infrared light. A main control part 95 of a control device 9 can detect a sectional shape of the solder paste based on an intensity distribution of the infrared light reflected by the substrate from image data of a taken image by the imaging device 6. Since reflected light from the solder paste surface can be removed by a removal part 95c, the sectional shape of the solder can be detected more accurately. COPYRIGHT: (C)2008,JPO&INPIT