Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape

摘要

A film carrier tape for mounting electronic components has a wiring with a wire pitch of 35 mum or less. A method for manufacturing such film carrier tape is also disclosed. The film carrier tape for mounting electronic components is manufactured using a specific flexible conductor foil clad laminate as a wiring forming material. The flexible conductor foil clad laminate includes a base film and a conductor foil having a surface roughness (Rz_jis) of a bonded surface of 2.5 mum or less and a surface roughness (Rz_jis) of a resist-side surface of 1.0 mum or less. The flexible conductor foil clad laminate may be a flexible copper clad laminate in which a glossy-surface-processed electrolytic copper foil has a surface roughness (Rz_jis) of a bonded surface of 2.5 mum or less and a surface roughness (Rz_jis) of a resist-side surface of 1.5 mum or less and in which the copper foil is half etched as required to not less than half an original thickness.