Electronic power package for e.g. diode, has two non-planar insulating substrates connected in connection regions, so that mechanical separation between substrates is controlled by number, arrangement, design and material of regions

摘要

The package (100) has two non-planar insulating substrates (1, 2) with high thermal conductivity. Electronic components e.g. semiconductor power transistor chip (20) and diode chip (30), are attached on each of the substrates. The substrates are connected with each other in connection regions, so that a mechanical separation between the substrates is controlled by the number of connection regions, an arrangement of connection regions, and design and material of the connection regions. The mechanical separation supplies an axially directed net compression force into the electronic components.