| 摘要 |
PROBLEM TO BE SOLVED: To suppress the gas generation derived from the heat during reflow soldering and to prevent the characteristic deterioration caused by the gas. SOLUTION: A circuit board 23 wherein electrical components 26 and 27 are mounted, a case base frame 24 a and top device board 25 are laminated. The above components 26 and 27 are stored in the case base frame 24. Then, the electrical components 26 and 27 are fixed to the circuit board 23 by using laser welding. COPYRIGHT: (C)2008,JPO&INPIT
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