| 摘要 |
PROBLEM TO BE SOLVED: To provide press-bonding method and device of a drive IC in which conductivity between a bump and a connection terminal can be prevented from worsening in the vicinity of four corners of the drive IC. SOLUTION: The press-bonding method of a drive IC 11 comprises a step for press-bonding a drive IC 11 by using a press-bonding device 20 (Fig.1C). The press-bonding head 22A of the press-bonding device 20 has a hot press surface 22Aa which is chamfered at each corner. Since the hot press surface 22Aa of the press-bonding head 22A abuts against a part of the drive IC 11 other than the four corners 11a, temperature of the binder layer 8 at the four corners 11a of the drive IC 11 is lower than the temperature of the binder layer 8 at other part. Since its fluidity is lowered and its discharge amount is reduced, poor conduction due to application of over pressure to conductive particles 9 is prevented. COPYRIGHT: (C)2008,JPO&INPIT
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