| 摘要 |
PROBLEM TO BE SOLVED: To provide: a semiconductor device manufacturing method which can connect a wiring to a thin film resistor body with reliability and can make the thin film resistor body stable in resistor value, even when the film thickness of the thin film resistor body is made still thinner; and a semiconductor device. SOLUTION: The semiconductor device manufacturing method comprises: a step for placing a conductive member on a substrate; a step for forming the thin film resistor body on the conductive member; a step for forming an insulation film on the thin film resistor body; and a step for forming a connection hole for connecting the thin film resistor body and a metal wiring formed on the insulation film on the insulation film in the upper region of a place where the conductive member is placed. COPYRIGHT: (C)2008,JPO&INPIT
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