| 摘要 |
In a method of producing a transponder (1) an integrated circuit (2, 72, 82) is produced. The integrated circuit (2, 72, 82) is produced by applying a photoresist layer (11) on a surface (8) of a semiconductor device (4), generating a patterned mask (14) by lithographically patterning the photoresist layer (11) so that the photoresist layer (11) comprises at least one aperture (12, 13), and filling the aperture (12, 13) with a bump (15, 16, 75, 76) by depositing the bump (15, 16, 75, 76) on the surface (8) utilizing the patterned mask (14). Finally, the integrated circuit (2, 72, 82), with the patterned mask (14), is attached to a substrate (3), which comprises an antenna structure (18). The bump (15, 16, 75, 76) is connected electrically to the antenna structure (18). |
