| 发明名称 |
VACUUM SUCTION DEVICE, AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To grind a highly precise wafer or the like by simplifying complicated operation such as fine adjustment of a grinding wheel spindle in grinding of a semiconductor wafer or the like by forming a mounting surface in anticipation of deformation in vacuum suction. <P>SOLUTION: The vacuum suction device has a mounting part 2 consisting of ceramics porous material for sucking and holding a suction target body in a mounting surface 2a and a supporting part 3 consisting of dense ceramics with an air inlet hole 4 communicating with an air hole of the mounting part. The mounting surface is a convex type whose top is almost its center 2b. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008060307(A) |
申请公布日期 |
2008.03.13 |
| 申请号 |
JP20060235165 |
申请日期 |
2006.08.31 |
| 申请人 |
TAIHEIYO CEMENT CORP |
发明人 |
UMETSU MOTOHIRO;SATO SHINYA |
| 分类号 |
H01L21/683;B23Q3/08;B24B37/30;H01L21/304 |
主分类号 |
H01L21/683 |
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