发明名称 ELECTRONIC COMPONENT PICKING-UP APPARATUS, SURFACE MOUNTER, AND ELECTRONIC COMPONENT PICKING-UP METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component picking-up apparatus configured to pick up electronic components from a group of electronic components stored in a wafer holder, which can correctly pick up each component from the group of electronic components even if the electronic components are ununiformly disposed on a wafer or the wafer holder is deformed. <P>SOLUTION: The apparatus is configured so as to identify and recognize a plurality of reference electronic components M1, M2 each marked in advance; and calculate the position of an electronic component 2a to be picked up, on the basis of the positions of the reference electronic components M1, M2 positioned near the electronic component 2a to be picked up, and component arrangement information of a wafer mapping file stored in a storage means. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060144(A) 申请公布日期 2008.03.13
申请号 JP20060232225 申请日期 2006.08.29
申请人 YAMAHA MOTOR CO LTD 发明人 KOBAYASHI KAZUHIRO
分类号 H05K13/04 主分类号 H05K13/04
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