| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a radiating substrate having a mechanical structure which has an excellent radiation, a high voltage resistance, a dielectric insulation, and a flexibility. <P>SOLUTION: The radiating substrate 20 for an electronic device includes a first metal layer 21, a second metal layer 22, and a heat-conductive polymer dielectric insulating layer 23. An LED is mounted on the surface of the first metal layer 21. The heat-conductive polymer dielectric insulating layer 23 is laminated between the first metal layer 21 and second metal layer 22 so as to contact with the first metal layer 21 and second metal layer 22 directly, and there is at least one fine rough surface having a surface roughness (Rz) larger than 7.0 between them. There are many nodular protrusions on the fine rough surface, and the particle diameter of the nodular protrusion mainly is 0.1 to 100μm. The heat conductivity of the radiating substrate 20 is more than 1 W/m×K, and its thickness is thinner than 0.5 mm, and the substrate contains (1) a polymer which has a melting point higher than 150°C and contains fluorine of 30 to 60 vol% and (2) a heat conductive filler, of 40 to 70 vol%, dispersed in the polymer containing fluorine. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
