METHODS OF FORMING A FLEXIBLE CIRCUIT BOARD

摘要

A method for forming a flexible circuit board includes placing an adhesive coated coverlay (104) over a flexible media (102), placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry (110). The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a f luoropolymer.