发明名称 THROUGH-HOLE MACHINING METHOD, THROUGH-HOLE MACHINING SYSTEM, AND MASK
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a through-hole machining method, which can simply machine a taperless through-hole using a simple optical member by a laser beam, a through-hole machining system, and a mask for use in the method. <P>SOLUTION: In this method, a through-hole is formed in a workpiece by a pulse laser beam. A workpiece 7 is irradiated with a laser beam through a mask 11 such that the profile of laser fluence of a pulse laser beam 5 shows a Gaussian distribution and the laser fluence of 1/(e<SP>1/2</SP>) of the maximum fluence in the Gaussian distribution is less than the abrasion threshold value of the workpiece. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008055466(A) 申请公布日期 2008.03.13
申请号 JP20060235417 申请日期 2006.08.31
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MISHIMA HIDEHIKO
分类号 B23K26/073;B23K26/06;B23K26/38;B23K101/42;H05K3/00 主分类号 B23K26/073
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