发明名称 |
Process Solutions Containing Surfactants |
摘要 |
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.
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申请公布号 |
US2008063984(A1) |
申请公布日期 |
2008.03.13 |
申请号 |
US20070940374 |
申请日期 |
2007.11.15 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
ZHANG PENG;CURZI DANIELLE M.K.;KARWACKI EUGENE J.JR.;BARBER LESLIE C. |
分类号 |
G03C5/00;G03F7/004;G03F7/09;G03F7/16;G03F7/30;G03F7/32;G03F7/38;G03F7/40;G03F7/42;H01L21/027;H01L21/304;H01L21/306 |
主分类号 |
G03C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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