| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for coaxial cable connection, converter and high-frequency device, wherein a coaxial cable is directly soldered in the irreducible minimum area on a surface of a substrate. <P>SOLUTION: A ground pattern 3 being connected electrically is formed on the surface of a substrate 1 and the ground pattern 3 soldering an outer conductor of a semi rigid cable 2 is wider than a soldering portion 6 of the outer conductor. On such a substrate 1, the ground pattern 3 is ground away around the soldering portion 6 to form a slit 7 at which the ground pattern 3 is cut, and the outer conductor is soldered in the area surrounded with the slit 7 on the ground pattern 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
