| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which elements built in a stack structure can be easily connected to each other by use of a thin metallic wire. SOLUTION: A semiconductor device 10A comprises a lower layer first semiconductor element 13, second semiconductor elements 14A and 14B, and a third semiconductor element 15. They are all laminated on the upper surface of the first semiconductor element 13. The semiconductor device has a structure in which the semiconductor elements are electrically connected to each other via a wiring substrate 16. Further, the wiring substrate 16 is adhered to the upper surface of the first semiconductor element 13. The wiring substrate 16 functions as a portion of a route which electrically connects the semiconductor elements built in the semiconductor device 10A to each other or the semiconductor element to the pad of a circuit substrate 17. COPYRIGHT: (C)2008,JPO&INPIT
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