发明名称 RESIN FINE PARTICLE, AND CONDUCTIVE PARTICULATE
摘要 PROBLEM TO BE SOLVED: To obtain conductive particulates with appropriate elasticity and capable of maintaining stable electric conduction in a microelement mounting, as well as to provide a conductive adhesive or the like using the same. SOLUTION: In a load removing test, the resin fine particles for conductive particulates provided have a compression rate of 50% or more when the particles are compressed at a load-loading speed of around 1.42196 mN/sec. and reach a load value P(N) expressed in the following formula (1) :P=7/96×d<SP>2</SP>×9.80665/1,000 [in the formula, d is a number average particle size (μm) of a fine particle, and P(N) is a value rounded off at the double digits below the decimal point], and a ratio of compression rate when the fine particles are repetitively compressed for 20 times is 80% or more of that for the first time. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008059914(A) 申请公布日期 2008.03.13
申请号 JP20060235830 申请日期 2006.08.31
申请人 HAYAKAWA RUBBER CO LTD 发明人 KIMURA TETSUYA;YAMADA KOSAKU
分类号 H01B5/00;C09J9/02;C09J11/00;H01R11/01;H05K3/32 主分类号 H01B5/00
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