| 摘要 |
PROBLEM TO BE SOLVED: To minimize poor bonding and stripping by enhancing bonding stability of an ink jet head. SOLUTION: An element 3 is provided on a substrate (Si wafer) and a plurality of rows of groove 4 are provided so as to surround the element 3. Two substrates are bonded under decompression environment. The groove becomes a decompression space 4 after bonding. A conventional recess, which is not contributive to bonding but prevents poor bonding, is used as a decompression space, so that a first substrate 1 and a second substrate 2 are pressed by atmospheric pressure and an effect of substantially increasing the bonding force is attained, thereby stabilizing the bonding. COPYRIGHT: (C)2008,JPO&INPIT
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