| 摘要 |
A photosensitive chip molding package includes a lead frame, a photosensitive chip mounted on the lead frame and having an photo-active zone and a photo-inactive zone surrounding the photo-active zone, a plurality of bonding wires electrically connected with the photosensitive chip and the lead frame, and an encapsulant molded on the photo-inactive zone of the photosensitive chip and the lead frame. The encapsulant covers the photo-inactive zone, the bonding wires and a part of the lead frame to define an opening corresponding to the photo-active zone. The encapsulant is made of light-blocking material.
|
