| 摘要 |
Provided is a silicon condenser microphone using a case in which a plating layer is formed on a body formed of resin. The silicon condenser microphone includes: a case having a can-shaped resin body with one side open, and a plating layer formed on the body; and a substrate on which a micro electro mechanical system (MEMS) microphone chip and an application-specific integrated circuit (ASIC) chip for processing an electrical signal are mounted, a connection pattern for attaching the case is formed, and the case is attached to the connection pattern using a conductive adhesive. The case may be formed in a cylindrical shape or a rectangular box shape. The plating layer may be formed on an inner surface, an outer surface, or an entire surface of the body and a step may be formed along an inner periphery on an end portion of an opening surface of the body.
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