METHOD OF FORMING WIRING, LIQUID-DROPLET DISCHARGING APPARATUS, AND CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming wiring in which uniformity of the wiring formed inside a hole is improved, a liquid-droplet discharging apparatus, and a circuit module.

SOLUTION: A laser device 22 and an irradiation optical system 23 irradiate a filling liquid droplet Ff landed on an opening of a via hole 7 with a laser beam Lf for filling to allow the filling liquid droplet Ff to flow from the region irradiated by the laser beam Lf for filling toward the inside of the via hole 7. The laser device 22 and the irradiation optical system 23 also irradiate continuously the region of the filling liquid droplet Ff flowed toward the inside of the via hole 7 with the laser beam Lf for filling to dry the filling liquid droplet Ff that fills the via hole 7.

COPYRIGHT: (C)2008,JPO&INPIT