PART MOUNTING SUBSTRATE, ELECTRONIC CIRCUIT DEVICE, NON-RECIPROCAL CIRCUIT ELEMENT, AND COMMUNICATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a part mounting substrate that reduces size, thickness, and costs effectively and has a structure capable of manufacturing a non-reciprocal circuit element having stable characteristics with a high yield, and to provide the non-reciprocal circuit element and a communication device using the non-reciprocal circuit element. SOLUTION: The part mounting substrate has a conductive substrate 10 and an insulation film 11. The insulation film 11 comprises an electrodeposition film. On at least one surface of the conductive substrate 10, there are ground electrodes 110-116 for exposing the surface of the conductive substrate 10. The insulation film 11 covers the entire surface of the conductive substrate 10 except the ground electrodes 110-116. COPYRIGHT: (C)2008,JPO&INPIT