发明名称 |
CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIONS FOR BODY-BIASING, METHODS OF USING SAME, AND SYSTEMS CONTAINING SAME |
摘要 |
A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
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申请公布号 |
US2008064144(A1) |
申请公布日期 |
2008.03.13 |
申请号 |
US20070935597 |
申请日期 |
2007.11.06 |
申请人 |
INTEL CORPORATION |
发明人 |
DANI ASHAY A.;JAYARAMAN SAIKUMAR;PATEL MITESH;WAKHARKAR VIJAY S. |
分类号 |
H01L21/64;B22F1/00;B22F3/12;B22F7/08 |
主分类号 |
H01L21/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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