发明名称 |
Laminierte Leiterplatte und Herstellungsverfahren |
摘要 |
A sheet composition comprises a first sheet layer in a raw state comprising an aggregate of a first powder and a second sheet layer is in a raw state disposed so as to make a contact with the first sheet layer and comprises an aggregate of a second powder not sintered at a temperature capable of sintering at least a part of the first powder. |
申请公布号 |
DE69936483(T2) |
申请公布日期 |
2008.03.13 |
申请号 |
DE1999636483T |
申请日期 |
1999.04.28 |
申请人 |
MURATA MFG. CO. LTD. |
发明人 |
KAMEDA, HIROKAZU;NAKAO, SHUYA;TANAKA, KENJI |
分类号 |
H05K3/46;B32B18/00;H01L21/48;H05K1/03 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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