发明名称 Laminierte Leiterplatte und Herstellungsverfahren
摘要 A sheet composition comprises a first sheet layer in a raw state comprising an aggregate of a first powder and a second sheet layer is in a raw state disposed so as to make a contact with the first sheet layer and comprises an aggregate of a second powder not sintered at a temperature capable of sintering at least a part of the first powder.
申请公布号 DE69936483(T2) 申请公布日期 2008.03.13
申请号 DE1999636483T 申请日期 1999.04.28
申请人 MURATA MFG. CO. LTD. 发明人 KAMEDA, HIROKAZU;NAKAO, SHUYA;TANAKA, KENJI
分类号 H05K3/46;B32B18/00;H01L21/48;H05K1/03 主分类号 H05K3/46
代理机构 代理人
主权项
地址