| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip mounted circuit and a mounted circuit therefor capable of preventing a semiconductor chip mounted circuit from being defective in conduction. <P>SOLUTION: The method for manufacturing a semiconductor chip mounted circuit 1 mainly includes three steps. In a first step, a conical/spiral contact 2 is formed by being soldered and plated on the surface of a connection terminal 12 in the mounted circuit 10. In a second step, a conduction inspection is performed by pressing a bump 21 of a semiconductor chip 20 against the contact 2. In a final third step, the connection terminal 12 and the bump 21 are bonded by melting the pressed contact 2. Namely, the semiconductor chip mounted circuit 1 scarcely causes a defect in conduction, because the semiconductor chip 20 and the mounted circuit 10 are bonded with both the devices that have passed the conduction inspection as it stands. <P>COPYRIGHT: (C)2008,JPO&INPIT |
