| 摘要 |
A photosensitive chip package includes a substrate, a photosensitive chip bonded on the substrate and having a photo-active zone and a photo-inactive zone surrounding the photo-active zone, a plurality of bonding wires electrically connected with the photosensitive chip and the substrate, and an encapsulant covering the photo-inactive zone of the photosensitive chip, the bonding wires and a part of the substrate and having an opening corresponding to the photo-active zone of the photosensitive chip.
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