| 摘要 |
<p>The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser (22), a substrate (24), and a tool (26). The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the substrate. The tool is disposed in removable contact with the substrate to conduct the heat energy away from the substrate to limit the altering of the substrate. Preferably, the tool has a thermal conductivity greater than that of the substrate and is more preferably a copper material, a gold material, a silver material, or an aluminum material.</p> |
