Encased PCB switch assembly with contact device

摘要

The arrangement has a substrate with conductive paths, and two conductive layers (60, 64) structured to form the conductive paths. The layers comprise a contact device to a joint surface of a semiconductor component (58) e.g. power diode, and a part of the conductive layers is a part of another contact device (4). The latter contact device comprises a spring unit with a support (30) in a housing (3) and a locking screw. The spring unit comprises a contact surface (402) for an external supply and another contact surface (606) for the layers.