发明名称 SUBSTRATE TREATING METHOD, SUBSTRATE TREATING DEVICE AND COMPUTER READABLE RECORDING MEDIUM COMPRISING PROGRAM
摘要 A substrate processing method, a substrate processing apparatus, and a program recording medium are provided to supply mixed fluid containing inert gas and processing liquid to a processing chamber where a substrate is accommodated for obtaining the substrate with the reduced number of particles remaining on its surface, and to improve the drying capability by increasing supply amount of the processing liquid. A substrate processing method by drying a substrate by using a fluid heated by a heating device having one or more heating mechanisms for heating the fluid, the method comprises the steps of: supplying inert gas and a processing liquid into the heating device via its inlet for heating a mixed fluid containing the inert gas and processing liquid within the heating device, while supplying the heated mixed fluid that is discharged from an outlet of the heating device, into a processing chamber in which the substrate is disposed, wherein the output of at least one heating mechanism of the heating device maintains a predetermined constant value until a predetermined period of time expires after the processing liquid is supplied to the heating device; and supplying inert gas within the heating device via the inlet for heating the inert gas within the heating device, while supplying the heated inert gas that is discharged from the outlet of the heating device, into the processing chamber, wherein the output of the mechanism of the heating device is determined by a feedback control for setting a temperature of the inert gas during or after heating at a predetermined value.
申请公布号 KR20080023120(A) 申请公布日期 2008.03.12
申请号 KR20070086176 申请日期 2007.08.27
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIMURA HIDEKI;NAKASHIMA MIKIO
分类号 H01L21/304 主分类号 H01L21/304
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