发明名称 Production of edible wafers by extrusion
摘要 A method for producing wafers by extrusion comprising the steps of a. Preparing an ingredient mix b. Feeding the mix in an extruder and cooking the mix c. Extruding the cooked mix such that an extruded and expanded non-planar structure is formed d. Unfolding the structure to give a large extruded sheet e. Subjecting the extruded sheet to stretching/pulling f. Adjusting the sheet in order to obtain a desired thickness g. Drying the sheet h. Separating the sheet into wafers of desired dimensions. is provided. The invention also relates to the wafers thus produced and to a wafer production line.
申请公布号 EP1897445(A1) 申请公布日期 2008.03.12
申请号 EP20060018976 申请日期 2006.09.11
申请人 NESTEC S.A. 发明人 DAUTREMONET, CHRISTOPHE;DE ACUTIS, RODOLFO;PIGUET, HUGO
分类号 A21C11/16;A21C3/04;A21C15/02 主分类号 A21C11/16
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