| 摘要 |
A tape type adhesive composition with high hardness is provided to adhere and fill panels without a welding point by being applied to the space between the panels of a car body and by being cured at an electrodeposition oven. An adhesive composition comprises a resin which comprises 5-10 wt% of a trimethylolpropane modified epoxy resin, 15-25 wt% of a nitrile-butadiene rubber(NBR) modified epoxy resin, 10-20 wt% of a bisphenol F type epoxy resin, 3-8 wt% of a carboxy-terminated butadiene-acrylonitrile copolymer modified epoxy resin, and 3-8 wt% of a dimer modified epoxy resin; 6-10 wt% of a latent curing agent; 6-10 wt% of the fumed silica coated with a fatty acid; 3-5 wt% of a humectant; 1-3 wt% of a colorant; 3-8 wt% of a processing aid; and 10-20 wt% of a filler. |
