ULTRA FINE SOLDER, METHOD FOR MANUFACTURING ULTRA FINE SOLDER AND MANUFACTURING APPARATUS USING THE SAME

摘要

An ultra fine solder, and an apparatus and a method for manufacturing an ultra fine solder are provided to form a circular powder by melting and sublimating a wire to minimize an amount of solder oxide formed on the surface of the powder as compared with that of a square-shape powder. A chamber(16) has an inactive atmosphere. A wire(12) is supplied in the chamber so that the wire is positioned between an anode and a cathode. Energy is supplied so that the supplied wire is completely sublimated to form powder. Powers having the size of 20micrometer or less are collected. The ratio of the supplied energy to the sublimation energy is in the range of 0.5 to 6. The supply rate of the wire is in the range of 2, 300mm/min to 4,400mm/min. The powders have a circular shape. An inactive gas in the chamber has the pressure in the range of 0.1kg/cm^2 to 4kg/cm^2.