| 摘要 |
An alkaline etching solution for a semiconductor wafer and an alkaline etching method are provided to reduce the size of a facet to improve surface roughness of the silicon by using bromate containing alkaline etching solution as a caustic alkaline aqueous solution. An alkaline etching solution for a semiconductor wafer is a caustic alkaline aqueous solution containing bromate. An alkaline etching method comprises the step of performing an alkaline etching using the caustic alkaline aqueous solution containing bromate, wherein the wafer after the etching process has a surface roughness(Ra) equal to or lower than 0.27 mum.
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