| 摘要 |
A microphone package is provided to allow an opened sound hole to be installed at a surface on which a microphone chip is installed, thereby easily manufacturing and minimizing the microphone package. A microphone package includes a housing. The housing has a cavity and a sound hole(27) allowing the cavity to communicate with an outside. A microphone chip(5) is installed at a surface of a substrate(3) for the microphone chip to detect a sound in the cavity. A projection wall(29) is projected toward an upward direction from the surface of the substrate between the sound hole and the microphone chip. The sound hole is surrounded by the projection wall. An external connection wire is electrically connected with the microphone chip. A predetermined parts of the external connection wire is exposed to an upper surface of the projection wall. A height of the projection wall is further increased between a predetermined parts of the external connection wire and the sound hole. |
