| 摘要 |
A POP(Package-on-Package) package and a manufacturing method thereof are provided to prevent disconnection of connection terminals even through a semiconductor package positioned at a lower portion is thickened. A first semiconductor package(100) includes a first substrate(110) having external contact electrodes(120) and a first semiconductor chip(140) mounted on the first substrate. A second semiconductor package includes a second substrate(210) having external contact electrodes(220) and a second semiconductor chip(240) mounted on the second substrate, in which the second semiconductor package overlies the first semiconductor package. Lead lines(200) electrically connects the external contact electrodes of the first substrate with the external contact electrodes of the second substrate. |
