| 摘要 |
A high frequency module that has a structure in which a frame-shaped shield case 3 is attached to a circuit substrate 2 , wherein an extending segment 331 that extends in an inward direction of the case is formed on a case side plate 31 of the shield case 3 , a protruding segment 332 is formed by providing a tip end portion of the extending segment 331 so as to stand perpendicularly, and an engaging portion 332 a is formed by swelling out an approximate midpoint of the protruding segment 332 in an inward direction of the case by a drawing process. Furthermore, an inserting hole 21 is formed in the circuit substrate 2 at a location that corresponds to the protruding segment 332 . Then, the shield case 3 is attached to the circuit substrate 2 by inserting the protruding segment 332 into the inserting hole 21 of the circuit substrate 2 so that the engaging portion 332 a is passed over.
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