Printed circuit board and method of manufacturing printed circuit board

摘要

A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30 a, a second resin substrate 30 b and a third resin substrate 30 c in a multilayer manner, the core substrate 30 can obtain sufficient strength.