发明名称 |
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling |
摘要 |
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
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申请公布号 |
US7342789(B2) |
申请公布日期 |
2008.03.11 |
申请号 |
US20060427384 |
申请日期 |
2006.06.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HALL SHAWN A.;TIAN SHURONG;COTEUS PAUL W.;KARIDIS JOHN P.;COLGAN EVAN G.;GUERNSEY, JR. ROBERT W. |
分类号 |
H05K7/20;F28D15/00;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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